facilitate BOM1 => BOM2 system migration:
BOM1 (reference) => BOM2 (revision NRE$) => MP (production$$)
(note): please prepare draft "datasheet" before decent FAE engagement
facilitate system/BOM1=> BOM2 migration:
legacy IoT => AIoT, physical AI
engagement based on system-level spec (with NDA first)
system PPA$; IP/chiplet reusable; timeline? budget?
design-for-system application (I)
其他資訊
- likely reuse the sub-system architecture (module);
- leverage chips in the markets, and create own differentiated chiplets/interface;
- strategy for design-for-supply chains;
- decent PDC (product development cycle) and time-to-markets revision.
[chiplets/package path-finding]:
1. chiplets #
2. pin-counts #
3. floor-plan what-if assessment
4. supplychain options...
design-for-supplychain resilience
其他資訊
4. matching IP vs. technology (process, sip, designs);
5. re-usability among applications: industry, automotive, space, etc.
6. practical design for supplychain options & operations.
=> talk to the experienced expertise.
[DfX]: IP/chiplets/adv-SiP integration
其他資訊
(it-was) >5 years for MEMS 0->1 PDC efforts;
(to-be) <1.5 years with proven-MEMS IP+process (minor tuning),
we help to improve 1->2/N PDC in <2 years, by decent/flexible
"AinterposerX" methodologies.
[DfX]: power-chains for system/BOM migration (310PLP)
e.g. from external power to 48v/12v~5v/3.3v~1.2v, and max power(heat), current(EM) constraints, etc
cloud-mode assessment:
https://fusion-sip-chipthermaldesign-en.pages.dev/chip_design
[DfX]: IP/chiplets/adv-SiP integration
partition/blocks vs. chiplets interconnection
DCD IPs for automotive interface, safety & security
[DfM]: CMP-PAD simulation; chip-thermal assessment (310PLP)
ex11: "sipID" from inline+offline lifetime traceability (310
ex12: 3dAOI => structured data & 100% inline QC (310PLP)
ex12: physical edge-AIoT
ex32: MEM+CMOS SiP accelerator (D2W, W2W)
其他資訊
(it-was) MEMS-KGD for dram/flash/sram assembly as PCB/PoP;
(to-be) MEM-hybrid for D2W, W2W interposer integration.
ex31: MEM-stack/SiP accelerator (D2W, W2W)
其他資訊
(it-was) MEMS-KGD for dram/flash/sram assembly as PCB/PoP;
(to-be) MEM-hybrid for D2W, W2W interposer integration.